48-6575 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS GLD

Part	Material Flammability Rating	Contact Material - Mating	Housing Material	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Features	Type	Type	Type	Pitch - Post	Pitch - Post	Contact Material - Post	Current Rating (Amps)	Number of Positions or Pins (Grid)	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Termination Post Length	Termination Post Length
Aries Electronics 48-6575-11	UL94 V-0	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Solder	10 çin	0.25 çm	Gold	10 çin	0.25 çm	Through Hole	Closed Frame	15.24 mm	DIP ZIF (ZIP)	0.6 "	2.54 mm	0.1 in	Beryllium Copper	1 A	48	0.1 in	2.54 mm	Gold	0.11 in	2.78 mm
Aries Electronics 48-6575-10	UL94 V-0	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Solder	10 çin	0.25 çm	Gold	10 çin	0.25 çm	Through Hole	Closed Frame	15.24 mm	DIP ZIF (ZIP)	0.6 "	2.54 mm	0.1 in	Beryllium Copper	1 A	48	0.1 in	2.54 mm	Gold	0.11 in	2.78 mm