44-3574 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS TIN

Part	Current Rating (Amps)	Mounting Type	Contact Material - Mating	Termination	Pitch - Post	Pitch - Post	Type	Type	Type	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Contact Material - Post	Material Flammability Rating	Contact Finish - Post
Aries Electronics 44-3574-10	1 A	Through Hole	Beryllium Copper	Solder	2.54 mm	0.1 in	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.1 in	2.54 mm	0.11 in	2.78 mm	Closed Frame	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	44 Positions or Pins	Beryllium Copper	UL94 V-0	Tin
Aries Electronics 44-3574-16	1 A	Through Hole	Beryllium Copper	Solder	2.54 mm	0.1 in	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.1 in	2.54 mm	0.11 in	2.78 mm	Closed Frame	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	44 Positions or Pins	Beryllium Copper	UL94 V-0	Tin
Aries Electronics 44-3574-18	1 A	Through Hole	Beryllium Copper	Solder	2.54 mm	0.1 in	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.1 in	2.54 mm	0.11 in	2.78 mm	Closed Frame	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	44 Positions or Pins	Beryllium Copper	UL94 V-0	Tin
Aries Electronics 44-3574-11	1 A	Through Hole	Beryllium Copper	Solder	2.54 mm	0.1 in	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.1 in	2.54 mm	0.11 in	2.78 mm	Closed Frame	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	44 Positions or Pins	Beryllium Copper	UL94 V-0	Tin