48-6574 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS GLD

Part	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Contact Material - Post	Type	Type	Type	Housing Material	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Contact Finish - Mating	Current Rating (Amps)	Material Flammability Rating	Contact Finish - Post	Termination	Features	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 48-6574-10	Through Hole	10 çin	0.25 çm	0.1 in	2.54 mm	Beryllium Copper	Beryllium Copper	15.24 mm	DIP ZIF (ZIP)	0.6 "	Polyphenylene Sulfide (PPS) Glass Filled	48	2.54 mm	0.1 in	Gold	1 A	UL94 V-0	Gold	Solder	Closed Frame	0.11 in	2.78 mm	10 çin	0.25 çm
Aries Electronics 48-6574-11	Through Hole	10 çin	0.25 çm	0.1 in	2.54 mm	Beryllium Copper	Beryllium Copper	15.24 mm	DIP ZIF (ZIP)	0.6 "	Polyphenylene Sulfide (PPS) Glass Filled	48	2.54 mm	0.1 in	Gold	1 A	UL94 V-0	Gold	Solder	Closed Frame	0.11 in	2.78 mm	10 çin	0.25 çm