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CONN IC DIP SOCKET ZIF 42POS TIN
| Part | Number of Positions or Pins (Grid) | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Features | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Material - Post | Pitch - Post | Pitch - Post | Termination Post Length | Termination Post Length | Type | Type | Type | Contact Material - Mating | Termination | Mounting Type | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 42 | 1 A | 0.1 in | 2.54 mm | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | 5.08 µm | 200 µin | Tin | Beryllium Copper | 2.54 mm | 0.1 in | 0.11 in | 2.78 mm | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Beryllium Copper | Solder | Through Hole | UL94 V-0 | 200 µin | 5.08 µm |
Aries Electronics | 42 | 1 A | 0.1 in | 2.54 mm | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | 5.08 µm | 200 µin | Tin | Beryllium Copper | 2.54 mm | 0.1 in | 0.11 in | 2.78 mm | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Beryllium Copper | Solder | Through Hole | UL94 V-0 | 200 µin | 5.08 µm |