42-6573 Series

Catalog

CONN IC DIP SOCKET ZIF 42POS TIN

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Material Flammability Rating	Features	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Contact Material - Post	Housing Material	Contact Finish - Post	Termination Post Length	Termination Post Length	Current Rating (Amps)	Mounting Type	Pitch - Post	Pitch - Post	Type	Type	Type	Number of Positions or Pins (Grid)
Aries Electronics 42-6573-16	200 µin	5.08 µm	Beryllium Copper	UL94 V-0	Closed Frame	0.1 in	2.54 mm	5.08 µm	200 µin	Solder	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Tin	0.11 in	2.78 mm	1 A	Through Hole	2.54 mm	0.1 in	15.24 mm	DIP ZIF (ZIP)	0.6 "	42
Aries Electronics 42-6573-11	200 µin	5.08 µm	Beryllium Copper	UL94 V-0	Closed Frame	0.1 in	2.54 mm	5.08 µm	200 µin	Solder	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Tin	0.11 in	2.78 mm	1 A	Through Hole	2.54 mm	0.1 in	15.24 mm	DIP ZIF (ZIP)	0.6 "	42
Aries Electronics 42-6573-10	200 µin	5.08 µm	Beryllium Copper	UL94 V-0	Closed Frame	0.1 in	2.54 mm	5.08 µm	200 µin	Solder	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Tin	0.11 in	2.78 mm	1 A	Through Hole	2.54 mm	0.1 in	15.24 mm	DIP ZIF (ZIP)	0.6 "	42