Beta
⌘K
HEAT SINK TO-252 COPPER
| Part | Shape | Width [y] | Width [y] | Material Finish | Thermal Resistance @ Natural | Power Dissipation @ Temperature Rise | Material | Thermal Resistance @ Forced Air Flow | Type | Package Cooled | Package Cooled | Fin Height | Fin Height | Length | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CUI Devices | Rectangular Fins | 22.86 mm | 0.9 in | Tin | 35.71 °C/W | 2.1 W 75 °C | Copper | 10.05 °C/W | Top Mount | TO-252 | DPak | 0.4 " | 10.16 mm | 8 mm | 0.315 in |