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CONN IC DIP SOCKET ZIF 40POS GLD
| Part | Features | Contact Finish - Post | Mounting Type | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Contact Material - Post | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Finish - Mating | Housing Material | Current Rating (Amps) | Pitch - Post | Pitch - Post | Termination | Type | Type | Type | Material Flammability Rating | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Closed Frame | Gold | Through Hole | 0.11 in | 2.78 mm | 0.1 in | 2.54 mm | Beryllium Copper | 40 | 20 | 2 | Gold | Polyphenylene Sulfide (PPS) Glass Filled | 1 A | 2.54 mm | 0.1 in | Solder | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | UL94 V-0 | Beryllium Copper | ||||
Aries Electronics | Closed Frame | Tin | Through Hole | 0.11 in | 2.78 mm | 0.1 in | 2.54 mm | Beryllium Copper | 40 | 20 | 2 | Polyphenylene Sulfide (PPS) Glass Filled | 1 A | 2.54 mm | 0.1 in | Solder | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | UL94 V-0 | Beryllium Copper | 5.08 µm | 200 µin | 200 µin | 5.08 µm |