48-3570 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS GLD

Part	Current Rating (Amps)	Type	Type	Type	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Termination	Mounting Type	Contact Finish - Post	Number of Positions or Pins (Grid)	Features	Housing Material	Contact Material - Mating	Pitch - Post	Pitch - Post	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length
Aries Electronics 48-3570-11	1 A	7.62 mm	0.3 in	DIP ZIF (ZIP)	UL94 V-0	10 çin	0.25 çm	Beryllium Copper	Solder	Through Hole	Gold	48	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	2.54 mm	0.1 in	Gold	10 çin	0.25 çm	0.1 in	2.54 mm	0.11 in	2.78 mm
Aries Electronics 48-3570-10	1 A	7.62 mm	0.3 in	DIP ZIF (ZIP)	UL94 V-0	200 µin	5.08 µm	Beryllium Copper	Solder	Through Hole	Tin	48	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	2.54 mm	0.1 in		200 µin	5.08 µm	0.1 in	2.54 mm	0.11 in	2.78 mm
Aries Electronics 48-3570-16	1 A	7.62 mm	0.3 in	DIP ZIF (ZIP)	UL94 V-0	50 µin	1.27 µm	Beryllium Nickel	Solder	Through Hole	Nickel Boron	48	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Nickel	2.54 mm	0.1 in	Nickel Boron	50 µin	1.27 µm	0.1 in	2.54 mm	0.11 in	2.78 mm