CONN SOCKET SIP 10POS GOLD
| Part | Termination | Contact Material - Mating | Termination Post Length [x] | Termination Post Length [x] | Operating Temperature [Min] | Operating Temperature [Max] | Material Flammability Rating | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Housing Material | Mounting Type | Pitch - Post | Pitch - Post | Type | Number of Positions or Pins (Grid) | Contact Material - Post [custom] | Contact Resistance | Contact Material - Post | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Features | Termination Post Length | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Omron Electronics Inc-EMC Div | Solder | Beryllium Copper | 0.138 in | 3.5 mm | -55 °C | 125 °C | UL94 V-0 | 1 A | 0.1 in | 2.54 mm | Gold | 10 çin | 0.25 çm | 10 çin | 0.25 çm | Gold | Polybutylene Terephthalate (PBT) Glass Filled | Threaded | 2.54 mm | 0.1 in | SIP | 10 | Brass | 20 mOhm | ||||||
Omron Electronics Inc-EMC Div | Solder | Beryllium Copper | -55 °C | 125 °C | UL94 V-0 | 1 A | 0.1 in | 2.54 mm | Gold | 30 µin | 0.76 µm | 30 Áin | 0.76 Ám | Gold | Polybutylene Terephthalate (PBT) Glass Filled | Through Hole | 2.54 mm | 0.1 in | SIP | 20 mOhm | Beryllium Copper | 1 x 32 | 32 | Closed Frame | ||||||
Omron Electronics Inc-EMC Div | Solder | Beryllium Copper | -55 °C | 125 °C | UL94 V-0 | 1 A | 0.1 in | 2.54 mm | Gold | 10 çin | 0.25 çm | 10 çin | 0.25 çm | Gold | Polybutylene Terephthalate (PBT) Glass Filled | Through Hole | 2.54 mm | 0.1 in | SIP | 3 | 20 mOhm | Beryllium Copper | Closed Frame | 3.2 mm | 0.126 in | |||||
Omron Electronics Inc-EMC Div | Solder | Beryllium Copper | -55 °C | 125 °C | UL94 V-0 | 1 A | 0.1 in | 2.54 mm | Gold | 10 çin | 0.25 çm | 10 çin | 0.25 çm | Gold | Polybutylene Terephthalate (PBT) Glass Filled | Through Hole | 2.54 mm | 0.1 in | SIP | 15 | 20 mOhm | Beryllium Copper | Closed Frame | 3.2 mm | 0.126 in | |||||
Omron Electronics Inc-EMC Div | Solder | Beryllium Copper | -55 °C | 125 °C | UL94 V-0 | 1 A | 0.1 in | 2.54 mm | Gold | 10 çin | 0.25 çm | 10 çin | 0.25 çm | Gold | Polybutylene Terephthalate (PBT) Glass Filled | Threaded | 2.54 mm | 0.1 in | SIP | Brass | 20 mOhm | 1 x 32 | 32 |