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CONN IC DIP SOCKET ZIF 48POS TIN
| Part | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination Post Length | Termination Post Length | Features | Contact Material - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Housing Material | Contact Finish - Post | Material Flammability Rating | Mounting Type | Current Rating (Amps) | Pitch - Post | Pitch - Post | Type | Type | Type | Termination | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 0.11 in | 2.78 mm | Closed Frame | Beryllium Copper | 5.08 µm | 200 µin | 48 | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | Tin | UL94 V-0 | Through Hole | 1 A | 2.54 mm | 0.1 in | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Solder | |
Aries Electronics | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | 0.11 in | 2.78 mm | Closed Frame | Beryllium Copper | 0.25 çm | 10 çin | 48 | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | Gold | UL94 V-0 | Through Hole | 1 A | 2.54 mm | 0.1 in | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Solder | Gold |