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IC MCU 32BIT ROMLESS 236FBGA
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Supplier Device Package | Voltage - Supply (Vcc/Vdd) [Max] | Voltage - Supply (Vcc/Vdd) [Min] | Core Size | Speed | Program Memory Type | Mounting Type | Connectivity | Package / Case | Oscillator Type | Core Processor | Number of I/O | RAM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
70 °C | 0 °C | 236-FBGA (10x10) | 3.6 V | 0.95 V | 10 Core 32 Bit | 2000 MIPS | ROMless | Surface Mount | USB | 236-LFBGA | External | XCore | 104 | 512 K | |
85 °C | -40 °C | 236-FBGA (10x10) | 3.6 V | 0.95 V | 10 Core 32 Bit | 2000 MIPS | ROMless | Surface Mount | USB | 236-LFBGA | External | XCore | 104 | 256 K | |
70 °C | 0 °C | 3.6 V | 0.95 V | 10 Core 32 Bit | 2000 MIPS | ROMless | Surface Mount | USB | 128-TQFP Exposed Pad | External | XCore | 81 | 512 K | ||
85 °C | -40 °C | 3.6 V | 0.95 V | 10 Core 32 Bit | 2000 MIPS | ROMless | Surface Mount | USB | 128-TQFP Exposed Pad | External | XCore | 81 | 512 K | ||
85 °C | -40 °C | 236-FBGA (10x10) | 3.6 V | 0.95 V | 10 Core 32 Bit | 2000 MIPS | ROMless | Surface Mount | USB | 236-LFBGA | External | XCore | 104 | 512 K |