32-1518 Series

Catalog

CONN IC DIP SOCKET 32POS GOLD

Part	Material Flammability Rating	Contact Finish - Post	Pitch - Post	Pitch - Post	Contact Material - Post [custom]	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Termination Post Length	Termination Post Length	Mounting Type	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Housing Material	Pitch - Mating	Pitch - Mating	Termination	Current Rating (Amps)	Type	Type	Type
Aries Electronics 32-1518-10	UL94 V-0	Tin	2.54 mm	0.1 in	Brass	Gold	200 µin	5.08 µm	Open Frame	3.18 mm	0.125 in	Through Hole	Beryllium Copper	10 çin	0.25 çm	2 x 16	32	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Solder	3 A	DIP	5.08 mm	0.2 in
Aries Electronics 32-1518-10H	UL94 V-0	Tin	2.54 mm	0.1 in	Brass	Gold	200 µin	5.08 µm	Open Frame	3.18 mm	0.125 in	Through Hole	Beryllium Copper	10 çin	0.25 çm	2 x 16	32	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Solder	3 A	DIP	5.08 mm	0.2 in
Aries Electronics 32-1518-11H	UL94 V-0	Gold	2.54 mm	0.1 in	Brass	Gold	10 çin	0.25 çm	Open Frame	3.18 mm	0.125 in	Through Hole	Beryllium Copper	10 çin	0.25 çm	2 x 16	32	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Solder	3 A	DIP	5.08 mm	0.2 in
Aries Electronics 32-1518-11	UL94 V-0	Gold	2.54 mm	0.1 in	Brass	Gold	10 çin	0.25 çm	Open Frame	3.18 mm	0.125 in	Through Hole	Beryllium Copper	10 çin	0.25 çm	2 x 16	32	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Solder	3 A	DIP	5.08 mm	0.2 in