UNIVERSAL TEST SOCKET 48POS
| Part | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Contact Material - Mating | Material Flammability Rating | Housing Material | Termination Post Length | Termination Post Length | Type | Type | Type | Pitch - Mating | Pitch - Mating | Termination | Mounting Type | Current Rating (Amps) | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post [custom] | Pitch - Post | Pitch - Post | Contact Finish - Post | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 48 | 30 Áin | 0.76 Ám | Open Frame | Beryllium Copper | UL94 V-0 | Polyphenylene Sulfide (PPS) Glass Filled | 10.74 mm | 0.423 in | DIP | 0.6 in | 15.24 mm | 0.1 in | 2.54 mm | Wire Wrap | Through Hole | 3 A | Gold | 200 µin | 5.08 µm | Brass | 2.54 mm | 0.1 in | Tin | |
Aries Electronics | 48 | 30 Áin | 0.76 Ám | Open Frame | Beryllium Copper | UL94 V-0 | Polyphenylene Sulfide (PPS) Glass Filled | 7.19 mm | 0.283 in | DIP | 0.6 in | 15.24 mm | 0.1 in | 2.54 mm | Wire Wrap | Through Hole | 3 A | Gold | 200 µin | 5.08 µm | Brass | 2.54 mm | 0.1 in | Tin | |
Aries Electronics | 48 | 30 Áin | 0.76 Ám | Open Frame | Beryllium Copper | UL94 V-0 | Polyphenylene Sulfide (PPS) Glass Filled | 10.74 mm | 0.423 in | DIP | 0.6 in | 15.24 mm | 0.1 in | 2.54 mm | Wire Wrap | Through Hole | 3 A | Gold | 10 çin | 0.25 çm | Brass | 2.54 mm | 0.1 in | Gold | 150 °C |
Aries Electronics | 48 | 30 Áin | 0.76 Ám | Open Frame | Beryllium Copper | UL94 V-0 | Polyphenylene Sulfide (PPS) Glass Filled | 3.3 mm | 0.13 in | DIP | 0.6 in | 15.24 mm | 0.1 in | 2.54 mm | Solder | Through Hole | 3 A | Gold | 200 µin | 5.08 µm | Brass | 2.54 mm | 0.1 in | Tin |