Beta
⌘K
HEAT SINK TO-263 COPPER
| Part | Type | Shape | Material | Width [x] | Width [x] | Fin Height | Fin Height | Thermal Resistance @ Natural | Length [x] | Length [x] | Material Finish | Thermal Resistance @ Forced Air Flow | Power Dissipation @ Temperature Rise | Package Cooled [custom] | Package Cooled [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CUI Devices | Top Mount | Rectangular Fins | Copper | 1.02 " | 25.91 mm | 9.52 mm | 0.375 in | 35.71 °C/W | 15 mm | 0.591 in | Tin | 8.15 °C/W 200 LFM | 2.1 W 75 °C | TO-263 | D²Pak |