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18P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+125℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS
| Part | Housing Material | Contact Material - Mating | Features | Type | Type | Type | Termination | Contact Finish - Post | Contact Resistance | Contact Material - Post [custom] | Termination Post Length | Termination Post Length | Mounting Type | Current Rating (Amps) | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Pitch - Post | Pitch - Post | Material Flammability Rating | Pitch - Mating | Pitch - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Harwin Inc. | Plastic | Beryllium Copper | Open Frame | 0.3 " | 7.62 mm | DIP | Solder | Tin | 10 mOhm | Brass | 3.2 mm | 0.126 in | Through Hole | 1 A | Flash | 18 | -55 °C | 125 °C | 196.9 µin | 5 µm | Gold | 2.54 mm | 0.1 in | UL94 V-0 | 0.1 in | 2.54 mm |