40-9503 Series

Catalog

CONN IC DIP SOCKET 40POS GOLD

Part	Contact Material - Mating	Current Rating (Amps)	Mounting Type	Termination	Contact Material - Post	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Housing Material	Termination Post Length [x]	Termination Post Length [x]	Operating Temperature [Min]	Operating Temperature [Max]	Material Flammability Rating	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length
Aries Electronics 40-9503-21	Beryllium Copper	3 A	Through Hole	Wire Wrap	Phosphor Bronze	22.86 mm	DIP	0.9 in	10 çin	0.25 çm	2.54 mm	0.1 in	40	20	2	Gold	10 çin	0.25 çm	Closed Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	0.36 in	9.14 mm	-55 °C	125 °C	UL94 V-0	Gold	0.1 in	2.54 mm
Aries Electronics 40-9503-30	Beryllium Copper	3 A	Through Hole	Wire Wrap	Phosphor Bronze	22.86 mm	DIP	0.9 in	200 µin	5.08 µm	2.54 mm	0.1 in	40	20	2	Gold	10 çin	0.25 çm	Closed Frame	Glass Filled Nylon 4/6 Polyamide (PA46)			-55 °C	105 ░C	UL94 V-0	Tin	0.1 in	2.54 mm	0.5 in	12.7 mm
Aries Electronics 40-9503-31	Beryllium Copper	3 A	Through Hole	Wire Wrap	Phosphor Bronze	22.86 mm	DIP	0.9 in	10 çin	0.25 çm	2.54 mm	0.1 in	40	20	2	Gold	10 çin	0.25 çm	Closed Frame	Glass Filled Nylon 4/6 Polyamide (PA46)			-55 °C	125 °C	UL94 V-0	Gold	0.1 in	2.54 mm	0.5 in	12.7 mm
Aries Electronics 40-9503-20	Beryllium Copper	3 A	Through Hole	Wire Wrap	Phosphor Bronze	22.86 mm	DIP	0.9 in	200 µin	5.08 µm	2.54 mm	0.1 in	40	20	2	Gold	10 çin	0.25 çm	Closed Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	0.36 in	9.14 mm	-55 °C	105 ░C	UL94 V-0	Tin	0.1 in	2.54 mm