CONN IC DIP SOCKET 40POS GOLD
| Part | Features | Contact Material - Mating | Contact Material - Post [custom] | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Post | Pitch - Post | Contact Finish - Mating | Type | Type | Type | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Material Flammability Rating | Termination | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Closed Frame | Beryllium Copper | Brass | 105 ░C | -55 °C | 2.54 mm | 0.1 in | Gold | 0.3 " | 7.62 mm | DIP | 40 | 20 | 2 | 3.56 mm | 0.14 in | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | Tin | 200 µin | 5.08 µm | 3 A | UL94 V-0 | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) |