CONN HEADER SMD 55POS 1MM
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Number of Positions | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions Loaded | Insulation Height | Insulation Height | Number of Rows | Contact Finish - Post | Material Flammability Rating | Fastening Type | Contact Length - Mating | Contact Length - Mating | Shrouding | Insulation Material | Connector Type | Contact Shape | Contact Type | Termination | Current Rating (Amps) | Mated Stacking Heights | Mounting Type | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Features | Insulation Color | Contact Material | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 10 çin | 0.25 çm | 0.039 in | 1 mm | 55 positions | -55 °C | 125 °C | All | 3.47 mm | 0.137 in | 2 | Tin | UL94 V-0 | Push-Pull | 0.065 in | 1.65 mm | Unshrouded | Liquid Crystal Polymer (LCP) | Header | Square | Male Pin | Solder | 2.8 A per Contact | 6 mm | Surface Mount | 2.54 mm | 0.1 in | Pick and Place | Black | Phosphor Bronze | Gold |
Samtec Inc. | 10 çin | 0.25 çm | 0.039 in | 1 mm | 55 positions | -55 °C | 125 °C | All | 3.47 mm | 0.137 in | 2 | Tin | UL94 V-0 | Push-Pull | 0.065 in | 1.65 mm | Unshrouded | Liquid Crystal Polymer (LCP) | Header | Square | Male Pin | Solder | 2.8 A per Contact | 6 mm | Surface Mount | 2.54 mm | 0.1 in | Pick and Place | Black | Phosphor Bronze | Gold |
Samtec Inc. | 3 µin | 0.076 µm | 0.039 in | 1 mm | 55 positions | -55 °C | 125 °C | All | 5.77 mm | 0.227 in | 2 | Tin | UL94 V-0 | Push-Pull | 0.065 in | 1.65 mm | Shrouded - 4 Wall | Liquid Crystal Polymer (LCP) | Header | Square | Male Pin | Solder | 2.8 A per Contact | 6 mm | Surface Mount | 2.54 mm | 0.1 in | Black | Phosphor Bronze | Gold |