48-3553 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS TIN

Part	Termination	Housing Material	Contact Finish - Post	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Material Flammability Rating	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Mounting Type	Features	Type	Type	Type	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 48-3553-10	Solder	Polyphenylene Sulfide (PPS) Glass Filled	Tin	0.11 in	2.78 mm	2.54 mm	0.1 in	UL94 V-0	1 A	0.1 in	2.54 mm	Beryllium Copper	Beryllium Copper	200 µin	5.08 µm	5.08 µm	200 µin	48	Through Hole	Closed Frame	7.62 mm	0.3 in	DIP ZIF (ZIP)
Aries Electronics 48-3553-16	Solder	Polyphenylene Sulfide (PPS) Glass Filled	Nickel Boron	0.11 in	2.78 mm	2.54 mm	0.1 in	UL94 V-0	1 A	0.1 in	2.54 mm	Beryllium Copper	Beryllium Copper	50 µin	1.27 µm	1.27 µm	50 µin	48	Through Hole	Closed Frame	7.62 mm	0.3 in	DIP ZIF (ZIP)	Nickel Boron
Aries Electronics 48-3553-18	Solder	Polyetheretherketone (PEEK) Glass Filled	Nickel Boron	0.11 in	2.78 mm	2.54 mm	0.1 in	UL94 V-0	1 A	0.1 in	2.54 mm	Beryllium Nickel	Beryllium Nickel	50 µin	1.27 µm	1.27 µm	50 µin	48	Through Hole	Closed Frame	7.62 mm	0.3 in	DIP ZIF (ZIP)	Nickel Boron	-55 °C	250 °C