Beta
⌘K
IC MCU 32BIT 3MB FLASH 176LQFP
| Part | Oscillator Type | Number of I/O | Speed | Package / Case | Supplier Device Package | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Program Memory Size | Peripherals | Core Size [custom] | Program Memory Type | Connectivity | Voltage - Supply (Vcc/Vdd) [Max] | Voltage - Supply (Vcc/Vdd) [Min] | Core Processor | RAM Size | EEPROM Size | Data Converters | Core Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Freescale Semiconductor - NXP | Internal | 129 I/O | 80 MHz 160 MHz | 176-LQFP Exposed Pad | 176-LQFP (24x24) | Surface Mount | 105 °C | -40 °C | 3 MB | DMA LVD POR WDT | 32-Bit Dual-Core | FLASH | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | 5.5 V | 3 V | e200z2 e200z4 | 512 K | |||
Freescale Semiconductor - NXP | Internal | 80 MHz 160 MHz | 100-LFBGA | 100-MAPBGA (11x11) | Surface Mount | 125 °C | -40 °C | 3 MB | DMA LVD POR WDT | 32-Bit Dual-Core | FLASH | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | 5.5 V | 3 V | e200z2 e200z4 | 512 K | ||||
Freescale Semiconductor - NXP | Internal | 80 MHz 160 MHz | 100-LFBGA | 100-MAPBGA (11x11) | Surface Mount | 125 °C | -40 °C | 3 MB | DMA LVD POR WDT | 32-Bit Dual-Core | FLASH | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | 5.5 V | 3 V | e200z2 e200z4 | 512 K | ||||
Freescale Semiconductor - NXP | Internal | 129 I/O | 80 MHz 160 MHz | 176-LQFP Exposed Pad | 176-LQFP (24x24) | Surface Mount | 105 °C | -40 °C | 3 MB | DMA LVD POR WDT | 32-Bit Dual-Core | FLASH | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | 5.5 V | 3 V | e200z2 e200z4 | 512 K | |||
Freescale Semiconductor - NXP | ||||||||||||||||||||
Freescale Semiconductor - NXP | Internal | 178 | 80 MHz 160 MHz | 256-LBGA | 256-MAPPBGA (17x17) | Surface Mount | 125 °C | -40 °C | 3 MB | DMA LVD POR WDT | 32-Bit Dual-Core | FLASH | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | 5.5 V | 3 V | e200z2 e200z4 | 512 K | |||
Freescale Semiconductor - NXP | Internal | 129 I/O | 80 MHz 160 MHz | 176-LQFP Exposed Pad | 176-LQFP (24x24) | Surface Mount | 105 °C | -40 °C | 3 MB | DMA LVD POR WDT | 32-Bit Dual-Core | FLASH | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | 5.5 V | 3.15 V | e200z2 e200z4 | 384 K | 128 K | 16x12b 36x10b | |
Freescale Semiconductor - NXP | Internal | 160 MHz | 100-LFBGA | 100-MAPBGA (11x11) | Surface Mount | 125 °C | -40 °C | 3 MB | DMA I2S POR WDT | FLASH | CANbus Ethernet FlexRay I2C LINbus SPI | 5.5 V | 3.15 V | e200z4 | 384 K | 64 K | 16x12b 36x10b | 32-Bit Single-Core | ||
Freescale Semiconductor - NXP | Internal | 129 I/O | 80 MHz 160 MHz | 176-LQFP Exposed Pad | 176-LQFP (24x24) | Surface Mount | 125 °C | -40 °C | 3 MB | DMA LVD POR WDT | 32-Bit Dual-Core | FLASH | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | 5.5 V | 3 V | e200z2 e200z4 | 512 K | |||
Freescale Semiconductor - NXP | Internal | 129 I/O | 120 MHz | 176-LQFP Exposed Pad | 176-LQFP (24x24) | Surface Mount | 105 °C | -40 °C | 3 MB | DMA I2S POR WDT | FLASH | CANbus Ethernet FlexRay I2C LINbus SPI | 5.5 V | 3.15 V | e200z4 | 384 K | 64 K | 16x12b 36x10b | 32-Bit Single-Core |