Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Pitch - Post | Pitch - Post | Operating Temperature [Max] | Operating Temperature [Min] | Material Flammability Rating | Type | Contact Material - Mating | Contact Material - Post | Mounting Type | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Termination Post Length | Termination Post Length | Contact Finish - Post | Termination | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 2.54 mm | 0.1 in | 125 °C | -65 ░C | UL94 V-0 | PGA ZIF (ZIP) | Beryllium Copper | Beryllium Copper | Through Hole | Gold | 200 µin | 5.08 µm | Closed Frame | 3.18 mm | 0.125 in | Tin | Solder | 1 A | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám |