SOLDER PASTE NO CLEAN 500GM
| Part | Form | Form | Type | Shelf Life Start | Melting Point [custom] | Melting Point [custom] | Shelf Life | Process | Shipping Info | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Min] | Mesh Type | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Kester Solder | Jar | 17.64 oz 500 g | Solder Paste | Date of Manufacture | 361 °F | 183 °C | 4 Months | Leaded | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | 0 °C | 50 °F | 10 °C | 0 °C | 3 | No-Clean |