HEATSINK COMPACT
| Part | Length | Length | Attachment Method | Power Dissipation @ Temperature Rise | Material Finish | Fin Height [z] | Fin Height [z] | Thermal Resistance @ Forced Air Flow | Shape | Width [x] | Width | Package Cooled | Type | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield-Vette | 50.8 mm | 2 in | Press Fit | 15 W 50 °C | Black Anodized | 50.8 mm | 2 in | 1.8 °C/W | Rectangular Fins | 1.5 in | 38.1 mm | Stud Mounted Semiconductor Cases | Board Level Vertical | Aluminum Alloy |