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CONN IC DIP SOCKET 40POS GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post | Contact Finish - Mating | Features | Contact Material - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Post [custom] | Termination | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Type | Type | Type | Material Flammability Rating | Contact Finish - Post | Housing Material | Current Rating (Amps) | Termination Post Length | Termination Post Length | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 30 Áin | 0.76 Ám | 2.54 mm | 0.1 in | Gold | Closed Frame | Beryllium Copper | 105 ░C | -55 °C | Brass | Solder | 0.1 in | 2.54 mm | 40 | 20 | 2 | 0.3 " | 7.62 mm | DIP | UL94 V-0 | Tin | Glass Filled Nylon 4/6 Polyamide (PA46) | 3 A | 3.56 mm | 0.14 in | 200 µin | 5.08 µm |