IC FLASH 2MBIT SPI/DUAL I/O 8SOP
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Memory Type | Memory Size | Memory Format | Clock Frequency | Memory Organization [custom] | Memory Organization [custom] | Mounting Type | Technology | Package / Case | Package / Case [y] | Package / Case [x] | Memory Interface | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Supplier Device Package | Voltage - Supply [Max] | Voltage - Supply [Min] | Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited | 85 °C | -40 °C | Non-Volatile | 2 Gbit | FLASH | 50 MHz | 256 K | 8 | Surface Mount | FLASH - NOR | 8-SOIC | 3.9 mm | 0.154 in | SPI - Dual I/O | 6 ms | 97 µs | 8-SOP | 2 V | 1.65 V | |
GigaDevice Semiconductor (HK) Limited | 85 °C | -40 °C | Non-Volatile | 2 Gbit | FLASH | 50 MHz | 256 K | 8 | Surface Mount | FLASH - NOR (SLC) | 8-XFDFN Exposed Pad | SPI - Dual I/O | 6 ms | 97 µs | 8-USON (1.5x1.5) | 2 V | 1.65 V | 12 ns | ||
GigaDevice Semiconductor (HK) Limited | 85 °C | -40 °C | Non-Volatile | 2 Gbit | FLASH | 50 MHz | 256 K | 8 | Surface Mount | FLASH - NOR (SLC) | 8-SOIC | 3.9 mm | 0.154 in | SPI - Dual I/O | 6 ms | 100 µs | 8-SOP | 2 V | 1.65 V | 12 ns |
GigaDevice Semiconductor (HK) Limited | 85 °C | -40 °C | Non-Volatile | 2 Gbit | FLASH | 50 MHz | 256 K | 8 | Surface Mount | FLASH - NOR (SLC) | 8-XFDFN Exposed Pad | SPI - Dual I/O | 6 ms | 100 µs | 8-USON (1.5x1.5) | 2 V | 1.65 V | 12 ns |