IC FLASH 8MBIT SPI/QUAD 8XSON
| Part | Memory Organization [custom] | Memory Organization [custom] | Package / Case | Memory Size | Mounting Type | Voltage - Supply [Max] | Voltage - Supply [Min] | Memory Format | Operating Temperature [Min] | Operating Temperature [Max] | Memory Interface | Memory Type | Technology | Clock Frequency | Supplier Device Package | Package / Case [y] | Package / Case [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 1 M | 8 bits | 8-XFDFN Exposed Pad | 1024 KB | Surface Mount | 1.95 V | 1.65 V | FLASH | -40 °C | 125 °C | SPI - Quad I/O | Non-Volatile | FLASH - NOR | 104 MHz | 8-XSON (2x3) | ||
Winbond Electronics | 1 M | 8 bits | 8-XFDFN Exposed Pad | 1024 KB | Surface Mount | 3.6 V | 2.7 V | FLASH | -40 °C | 125 °C | SPI - Quad I/O | Non-Volatile | FLASH - NOR | 80 MHz | 8-XSON (2x3) | ||
Winbond Electronics | 1 M | 8 bits | 8-XFDFN Exposed Pad | 1024 KB | Surface Mount | 1.95 V | 1.65 V | FLASH | -40 °C | 105 °C | SPI - Quad I/O | Non-Volatile | FLASH - NOR | 104 MHz | 8-XSON (2x3) | ||
Winbond Electronics | 1 M | 8 bits | 8-SOIC | 1024 KB | Surface Mount | 1.95 V | 1.65 V | FLASH | -40 °C | 125 °C | SPI - Quad I/O | Non-Volatile | FLASH - NOR | 104 MHz | 8-SOIC | 5.3 mm | 0.209 " |
Winbond Electronics | 1 M | 8 bits | 8-XFDFN Exposed Pad | 1024 KB | Surface Mount | 3.6 V | 2.7 V | FLASH | -40 °C | 105 °C | SPI - Quad I/O | Non-Volatile | FLASH - NOR | 80 MHz | 8-XSON (2x3) | ||
Winbond Electronics | 1 M | 8 bits | 8-SOIC | 1024 KB | Surface Mount | 3.6 V | 2.7 V | FLASH | -40 °C | 125 °C | SPI - Quad I/O | Non-Volatile | FLASH - NOR | 80 MHz | 8-SOIC | 3.9 mm | 0.154 in |