44-6574 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS TIN

Part	Type	Type	Type	Termination	Mounting Type	Contact Finish - Post	Contact Material - Post	Housing Material	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Contact Material - Mating	Current Rating (Amps)	Number of Positions or Pins (Grid)	Material Flammability Rating	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 44-6574-10	15.24 mm	DIP ZIF (ZIP)	0.6 "	Solder	Through Hole	Tin	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	0.11 in	2.78 mm	0.1 in	2.54 mm	200 µin	5.08 µm	Closed Frame	Beryllium Copper	1 A	44 Positions or Pins	UL94 V-0	2.54 mm	0.1 in	5.08 µm	200 µin
Aries Electronics 44-6574-18	15.24 mm	DIP ZIF (ZIP)	0.6 "	Solder	Through Hole	Tin	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	0.11 in	2.78 mm	0.1 in	2.54 mm	200 µin	5.08 µm	Closed Frame	Beryllium Copper	1 A	44 Positions or Pins	UL94 V-0	2.54 mm	0.1 in	5.08 µm	200 µin
Aries Electronics 44-6574-16	15.24 mm	DIP ZIF (ZIP)	0.6 "	Solder	Through Hole	Tin	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	0.11 in	2.78 mm	0.1 in	2.54 mm	200 µin	5.08 µm	Closed Frame	Beryllium Copper	1 A	44 Positions or Pins	UL94 V-0	2.54 mm	0.1 in	5.08 µm	200 µin
Aries Electronics 44-6574-11	15.24 mm	DIP ZIF (ZIP)	0.6 "	Solder	Through Hole	Tin	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	0.11 in	2.78 mm	0.1 in	2.54 mm	200 µin	5.08 µm	Closed Frame	Beryllium Copper	1 A	44 Positions or Pins	UL94 V-0	2.54 mm	0.1 in	5.08 µm	200 µin