50-9513 Series

Catalog

CONN IC DIP SOCKET 50POS GOLD

Part	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Termination	Termination Post Length	Termination Post Length	Type	Type	Type	Housing Material	Operating Temperature [Max]	Operating Temperature [Min]	Material Flammability Rating	Features	Mounting Type	Contact Finish - Post	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Material - Post [custom]
Aries Electronics 50-9513-11H	Beryllium Copper	10 çin	0.25 çm	2.54 mm	0.1 in	10 çin	0.25 çm	Gold	3 A	0.1 in	2.54 mm	Solder	3.18 mm	0.125 in	22.86 mm	DIP	0.9 in	Glass Filled Nylon 4/6 Polyamide (PA46)	105 ░C	-55 °C	UL94 V-0	Closed Frame	Through Hole	Gold	25	2	50	Brass
Aries Electronics 50-9513-11	Beryllium Copper	10 çin	0.25 çm	2.54 mm	0.1 in	10 çin	0.25 çm	Gold	3 A	0.1 in	2.54 mm	Solder	3.18 mm	0.125 in	22.86 mm	DIP	0.9 in	Glass Filled Nylon 4/6 Polyamide (PA46)	105 ░C	-55 °C	UL94 V-0	Closed Frame	Through Hole	Gold	25	2	50	Brass
Aries Electronics 50-9513-10T	Beryllium Copper	10 çin	0.25 çm	2.54 mm	0.1 in	200 µin	5.08 µm	Gold	3 A	0.1 in	2.54 mm	Solder	3.18 mm	0.125 in	22.86 mm	DIP	0.9 in	Glass Filled Nylon 4/6 Polyamide (PA46)	105 ░C	-55 °C	UL94 V-0	Closed Frame	Through Hole	Tin	25	2	50	Brass
Aries Electronics 50-9513-10H	Beryllium Copper	10 çin	0.25 çm	2.54 mm	0.1 in	200 µin	5.08 µm	Gold	3 A	0.1 in	2.54 mm	Solder	3.18 mm	0.125 in	22.86 mm	DIP	0.9 in	Glass Filled Nylon 4/6 Polyamide (PA46)	105 ░C	-55 °C	UL94 V-0	Closed Frame	Through Hole	Tin	25	2	50	Brass