IC MEMORY
| Part | Package / Case | Operating Temperature [Max] | Operating Temperature [Min] | Memory Interface | Memory Organization | Write Cycle Time - Word, Page | Memory Type | Mounting Type | Supplier Device Package | Voltage - Supply [Max] | Voltage - Supply [Min] | Technology | Memory Format | Memory Size | Access Time | Package / Case [y] | Package / Case [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited | 63-VFBGA | 85 °C | -40 °C | ONFI | 512 M | 25 ns | Non-Volatile | Surface Mount | 63-FBGA (9x11) | 1.95 V | 1.7 V | FLASH - NAND (SLC) | FLASH | 512 kb | 22 ns | ||
GigaDevice Semiconductor (HK) Limited | FLASH - NAND | FLASH | |||||||||||||||
GigaDevice Semiconductor (HK) Limited | 63-VFBGA | 85 °C | -40 °C | ONFI | 512 M | 25 ns | Non-Volatile | Surface Mount | 63-FBGA (9x11) | 1.95 V | 1.7 V | FLASH - NAND (SLC) | FLASH | 512 kb | 22 ns | ||
GigaDevice Semiconductor (HK) Limited | 63-VFBGA | 105 °C | -40 °C | ONFI | 512 M | 25 ns | Non-Volatile | Surface Mount | 63-FBGA (9x11) | 1.95 V | 1.7 V | FLASH - NAND (SLC) | FLASH | 512 kb | 22 ns | ||
GigaDevice Semiconductor (HK) Limited | 48-TFSOP | 85 °C | -40 °C | ONFI | 512 M | 25 ns | Non-Volatile | Surface Mount | 48-TSOP I | 1.95 V | 1.7 V | FLASH - NAND (SLC) | FLASH | 512 kb | 22 ns | 18.4 mm | 0.724 in |