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CONN IC DIP SOCKET 32POS GOLD
| Part | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Contact Finish - Post | Contact Finish Thickness - Mating | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Material - Post [custom] | Contact Resistance | Contact Finish - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Features | Termination | Housing Material | Mounting Type | Type | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Harwin Inc. | Beryllium Copper | 196.9 µin | 5 µm | 1 A | Tin | Flash | 3.2 mm | 0.126 in | 0.1 in | 2.54 mm | UL94 V-0 | 2.54 mm | 0.1 in | 2 x 16 | 32 | Brass | 10 mOhm | Gold | -55 °C | 125 °C | Open Frame | Solder | Plastic | Through Hole | DIP | 0.6 in | 15.24 mm |