CONN IC DIP SOCKET 40POS GOLD
| Part | Contact Finish - Post | Termination Post Length | Termination Post Length | Housing Material | Type | Type | Type | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post [custom] | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Material Flammability Rating | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Termination | Contact Material - Mating | Current Rating (Amps) | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Mating | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Gold | 3.18 mm | 0.125 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 22.86 mm | DIP | 0.9 in | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Brass | Through Hole | 10 çin | 0.25 çm | UL94 V-0 | 2.54 mm | 0.1 in | 40 | 20 | 2 | Solder | Beryllium Copper | 3 A | 105 ░C | -55 °C | Gold | Closed Frame |
Aries Electronics | Tin | 3.18 mm | 0.125 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 22.86 mm | DIP | 0.9 in | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Brass | Through Hole | 200 µin | 5.08 µm | UL94 V-0 | 2.54 mm | 0.1 in | 40 | 20 | 2 | Solder | Beryllium Copper | 3 A | 105 ░C | -55 °C | Gold | Closed Frame |