IC DRAM 256MBIT PAR 54VFBGA
| Part | Supplier Device Package | Memory Interface | Technology | Mounting Type | Memory Type | Access Time | Package / Case | Voltage - Supply [Max] | Voltage - Supply [Min] | Memory Size | Memory Format | Write Cycle Time - Word, Page | Clock Frequency | Operating Temperature [Max] | Operating Temperature [Min] | Memory Organization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 54-VFBGA (8x9) | Parallel | SDRAM - Mobile LPSDR | Surface Mount | Volatile | 5.4 ns | 54-TFBGA | 1.95 V | 1.7 V | 256 Gbit | DRAM | 15 ns | 166 MHz | 85 °C | -40 °C | 16 M |
Winbond Electronics | 54-VFBGA (8x9) | Parallel | SDRAM - Mobile LPSDR | Surface Mount | Volatile | 5.4 ns | 54-TFBGA | 1.95 V | 1.7 V | 256 Gbit | DRAM | 15 ns | 133 MHz | 85 °C | -25 °C | 16 M |
Winbond Electronics | 54-VFBGA (8x9) | Parallel | SDRAM - Mobile LPSDR | Surface Mount | Volatile | 5.4 ns | 54-TFBGA | 1.95 V | 1.7 V | 256 Gbit | DRAM | 15 ns | 166 MHz | 85 °C | -25 °C | 16 M |
Winbond Electronics | 54-VFBGA (8x9) | Parallel | SDRAM - Mobile LPSDR | Surface Mount | Volatile | 5.4 ns | 54-TFBGA | 1.95 V | 1.7 V | 256 Gbit | DRAM | 15 ns | 133 MHz | 85 °C | -25 °C | 16 M |
Winbond Electronics | 54-VFBGA (8x9) | LVCMOS | SDRAM - Mobile LPSDR | Surface Mount | Volatile | 5.4 ns | 54-TFBGA | 1.95 V | 1.7 V | 256 Gbit | DRAM | 15 ns | 133 MHz | 85 °C | -40 °C | 16 M |
Winbond Electronics | 54-VFBGA (8x9) | Parallel | SDRAM - Mobile LPSDR | Surface Mount | Volatile | 5.4 ns | 54-TFBGA | 1.95 V | 1.7 V | 256 Gbit | DRAM | 15 ns | 166 MHz | 85 °C | -40 °C | 16 M |