Beta
⌘K
CONN IC DIP SOCKET ZIF 42POS
| Part | Operating Temperature [Min] | Operating Temperature [Max] | Pitch - Post | Pitch - Post | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Contact Finish - Mating | Current Rating (Amps) | Termination | Number of Positions or Pins (Grid) | Housing Material | Contact Material - Post | Termination Post Length | Termination Post Length | Features | Material Flammability Rating | Contact Material - Mating | Pitch - Mating | Pitch - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | -55 °C | 250 °C | 2.54 mm | 0.1 in | Through Hole | 1.27 µm | 50 µin | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 1.27 µm | 50 µin | Nickel Boron | Nickel Boron | 1 A | Solder | 42 | Polyetheretherketone (PEEK) Glass Filled | Beryllium Nickel | 0.11 in | 2.78 mm | Closed Frame | UL94 V-0 | Beryllium Nickel | 0.1 in | 2.54 mm |
Aries Electronics | 2.54 mm | 0.1 in | Through Hole | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Gold | Gold | 1 A | Solder | 42 | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | 0.11 in | 2.78 mm | Closed Frame | UL94 V-0 | Beryllium Copper | 0.1 in | 2.54 mm |