48-3574 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS TIN

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Type	Type	Type	Pitch - Mating	Pitch - Mating	Termination	Contact Finish - Post	Housing Material	Features	Contact Material - Post	Material Flammability Rating	Pitch - Post	Pitch - Post	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)
Aries Electronics 48-3574-16	1 A	0.11 in	2.78 mm	5.08 µm	200 µin	Beryllium Copper	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.1 in	2.54 mm	Solder	Tin	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	Beryllium Copper	UL94 V-0	2.54 mm	0.1 in	Through Hole	200 µin	5.08 µm	48
Aries Electronics 48-3574-18	1 A	0.11 in	2.78 mm	5.08 µm	200 µin	Beryllium Copper	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.1 in	2.54 mm	Solder	Tin	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	Beryllium Copper	UL94 V-0	2.54 mm	0.1 in	Through Hole	200 µin	5.08 µm	48