HEATSINK FOR 45MM BGA
| Part | Attachment Method | Length | Length | Package Cooled | Material Finish | Shape | Material | Thermal Resistance @ Forced Air Flow | Type | Width [x] | Width [x] | Fin Height | Fin Height |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield-Vette | Thermal Tape Adhesive (Included) | 44.45 mm | 1.75 in | ASIC BGA CPU LGA | Black Anodized | Pin Fins Square | Aluminum | 10 °C/W 150 LFM | Top Mount | 43.18 mm | 1.7 in | 8.89 mm | 0.35 in |
Wakefield-Vette | Thermal Tape Adhesive (Included) | 44.45 mm | 1.75 in | ASIC BGA CPU LGA | Black Anodized | Pin Fins Square | Aluminum | 10 °C/W 150 LFM | Top Mount | 43.18 mm | 1.7 in | 8.89 mm | 0.35 in |
Wakefield-Vette | Thermal Tape Adhesive (Included) | 44.45 mm | 1.75 in | ASIC BGA CPU LGA | Black Anodized | Pin Fins Square | Aluminum | 10 °C/W 150 LFM | Top Mount | 43.18 mm | 1.7 in | 8.89 mm | 0.35 in |
Wakefield-Vette | Thermal Tape Adhesive (Included) | 44.45 mm | 1.75 in | ASIC BGA CPU LGA | Black Anodized | Pin Fins Square | Aluminum | 10 °C/W 150 LFM | Top Mount | 43.18 mm | 1.7 in | 8.89 mm | 0.35 in |