CONN EDGE DUAL FML 104POS 0.100
| Part | Termination Rows | Pitch [x] | Pitch [x] | Number of Rows | Termination | Contact Finish | Operating Temperature [Max] | Operating Temperature [Min] | Card Thickness [Min] | Card Thickness [Min] | Card Thickness [Max] | Card Thickness [Max] | Number of Positions/Bay/Row [custom] | Read Out | Contact Finish Thickness | Contact Finish Thickness | Card Type | Contact Material | Flange Feature [diameter] | Flange Feature | Flange Feature [diameter] | Mounting Type | Material - Insulation | Number of Positions | Gender | Color | Contact Type | Features | Flange Feature | Flange Feature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
EDAC Inc. | 2 | 2.54 mm | 0.1 in | 2 | Solder | Gold | 125 °C | -40 °C | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | 52 | Dual | 10 Áin | 0.25 Ám | Non Specified - Dual Edge | Copper Alloy | 2.95 mm | Floating Bobbin Top Mount Opening | 0.116 in | Through Hole | Polyphenylene Sulfide (PPS) | 104 | Female | Black | Cantilever | |||
EDAC Inc. | 2 | 2.54 mm | 0.1 in | 2 | Solder Eyelet(s) | Gold | 125 °C | -40 °C | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | 52 | Dual | 10 Áin | 0.25 Ám | Non Specified - Dual Edge | Copper Alloy | Flush Mount M3 Threaded Insert Top Opening | Through Hole | Polyphenylene Sulfide (PPS) | 104 | Female | Black | Cantilever | |||||
EDAC Inc. | 2 | 2.54 mm | 0.1 in | 2 | Solder | Gold | 125 °C | -40 °C | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | 52 | Dual | 10 Áin | 0.25 Ám | Non Specified - Dual Edge | Copper Alloy | M3 Threaded Insert Top Mount Opening | Through Hole | Polyphenylene Sulfide (PPS) | 104 | Female | Black | Cantilever | |||||
EDAC Inc. | 2 | 2.54 mm | 0.1 in | 2 | Solder | Gold | 125 °C | -40 °C | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | 52 | Dual | 10 Áin | 0.25 Ám | Non Specified - Dual Edge | Copper Alloy | Side Mount Opening Unthreaded | Board Edge Straddle Mount | Polyphenylene Sulfide (PPS) | 104 | Female | Black | Cantilever | Card Extender | 3.25 mm | 0.128 in | ||
EDAC Inc. | 2 | 2.54 mm | 0.1 in | 2 | Solder | Gold | 125 °C | -40 °C | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | 52 | Dual | 10 Áin | 0.25 Ám | Non Specified - Dual Edge | Copper Alloy | 4-40 Threaded Insert Top Mount Opening | Through Hole | Polyphenylene Sulfide (PPS) | 104 | Female | Black | Cantilever | |||||
EDAC Inc. | 2 | 2.54 mm | 0.1 in | 2 | Solder | Gold | 125 °C | -40 °C | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | 52 | Dual | 10 Áin | 0.25 Ám | Non Specified - Dual Edge | Copper Alloy | 3.25 mm | Flush Mount Top Opening Unthreaded | 0.128 " | Through Hole | Polyphenylene Sulfide (PPS) | 104 | Female | Black | Cantilever | |||
EDAC Inc. | 2 | 2.54 mm | 0.1 in | 2 | Wire Wrap | Gold | 125 °C | -40 °C | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | 52 | Dual | 10 Áin | 0.25 Ám | Non Specified - Dual Edge | Copper Alloy | Side Mount Opening Unthreaded | Through Hole | Polyphenylene Sulfide (PPS) | 104 | Female | Black | Cantilever | 3.25 mm | 0.128 in | |||
EDAC Inc. | 2 | 2.54 mm | 0.1 in | 2 | Solder | Gold | 125 °C | -40 °C | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | 52 | Dual | 10 Áin | 0.25 Ám | Non Specified - Dual Edge | Copper Alloy | 2.95 mm | Floating Bobbin Flush Mount | 0.116 in | Through Hole | Polyphenylene Sulfide (PPS) | 104 | Female | Black | Cantilever | |||
EDAC Inc. | 2 | 2.54 mm | 0.1 in | 2 | Wire Wrap | Gold | 125 °C | -40 °C | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | 52 | Dual | 10 Áin | 0.25 Ám | Non Specified - Dual Edge | Copper Alloy | 3.96 mm | Top Mount Opening Unthreaded | 0.156 in | Through Hole | Polyphenylene Sulfide (PPS) | 104 | Female | Black | Cantilever | |||
EDAC Inc. | 2 | 2.54 mm | 0.1 in | 2 | Solder | Gold | 125 °C | -40 °C | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | 52 | Dual | 10 Áin | 0.25 Ám | Non Specified - Dual Edge | Copper Alloy | 3.25 mm | Flush Mount Side Opening Unthreaded | 0.128 " | Board Edge Straddle Mount | Polyphenylene Sulfide (PPS) | 104 | Female | Black | Cantilever | Card Extender |