CONN IC DIP SOCKET 50POS GOLD
| Part | Material Flammability Rating | Type | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Contact Material - Mating | Mounting Type | Contact Finish - Post | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Features | Termination | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Housing Material | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Contact Material - Post [custom] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 22.86 mm | DIP | 0.9 in | 10 çin | 0.25 çm | 3 A | Beryllium Copper | Through Hole | Gold | 25 | 2 | 50 | Open Frame | Solder | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.1 in | 2.54 mm | Gold | Brass | 10 çin | 0.25 çm |
Aries Electronics | UL94 V-0 | 22.86 mm | DIP | 0.9 in | 200 µin | 5.08 µm | 3 A | Beryllium Copper | Through Hole | Tin | 25 | 2 | 50 | Open Frame | Solder | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.1 in | 2.54 mm | Gold | Brass | 10 çin | 0.25 çm |
Aries Electronics | UL94 V-0 | 22.86 mm | DIP | 0.9 in | 200 µin | 5.08 µm | 3 A | Beryllium Copper | Through Hole | Tin | 25 | 2 | 50 | Open Frame | Solder | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.1 in | 2.54 mm | Gold | Brass | 10 çin | 0.25 çm |
Aries Electronics | UL94 V-0 | 22.86 mm | DIP | 0.9 in | 200 µin | 5.08 µm | 3 A | Beryllium Copper | Through Hole | Tin | 25 | 2 | 50 | Open Frame | Solder | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.1 in | 2.54 mm | Gold | Brass | 10 çin | 0.25 çm |
Aries Electronics | UL94 V-0 | 22.86 mm | DIP | 0.9 in | 200 µin | 5.08 µm | 3 A | Beryllium Copper | Through Hole | Tin | 25 | 2 | 50 | Open Frame | Solder | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.1 in | 2.54 mm | Gold | Brass | 10 çin | 0.25 çm |
Aries Electronics | UL94 V-0 | 22.86 mm | DIP | 0.9 in | 200 µin | 5.08 µm | 3 A | Beryllium Copper | Through Hole | Tin | 25 | 2 | 50 | Open Frame | Solder | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.1 in | 2.54 mm | Gold | Brass | 10 çin | 0.25 çm |