32-6508 Series

Catalog

CONN IC DIP SOCKET 32POS GOLD

Part	Contact Material - Post [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Type	Type	Type	Pitch - Post	Pitch - Post	Mounting Type	Termination	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Features	Material Flammability Rating	Current Rating (Amps)	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 32-6508-31	Brass	2 x 16	32	DIP	0.6 in	15.24 mm	2.54 mm	0.1 in	Through Hole	Wire Wrap	Gold	-55 °C	125 °C	0.1 in	2.54 mm	0.5 in	12.7 mm	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	UL94 V-0	3 A	Beryllium Copper	30 Áin	0.76 Ám
Aries Electronics 32-6508-212	Brass	2 x 16	32	DIP	0.6 in	15.24 mm	2.54 mm	0.1 in	Through Hole	Wire Wrap	Gold	-55 °C	125 °C	0.1 in	2.54 mm	0.5 in	12.7 mm	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	UL94 V-0	3 A	Beryllium Copper	30 Áin	0.76 Ám
Aries Electronics 32-6508-311	Brass	2 x 16	32	DIP	0.6 in	15.24 mm	2.54 mm	0.1 in	Through Hole	Wire Wrap	Gold	-55 °C	125 °C	0.1 in	2.54 mm	0.5 in	12.7 mm	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	UL94 V-0	3 A	Beryllium Copper	30 Áin	0.76 Ám
Aries Electronics 32-6508-302	Brass	2 x 16	32	DIP	0.6 in	15.24 mm	2.54 mm	0.1 in	Through Hole	Wire Wrap	Gold	-55 °C	105 ░C	0.1 in	2.54 mm			Tin	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	UL94 V-0	3 A	Beryllium Copper	30 Áin	0.76 Ám	0.36 in	9.14 mm
Aries Electronics 32-6508-301	Brass	2 x 16	32	DIP	0.6 in	15.24 mm	2.54 mm	0.1 in	Through Hole	Wire Wrap	Gold	-55 °C	105 ░C	0.1 in	2.54 mm			Tin	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	UL94 V-0	3 A	Beryllium Copper	30 Áin	0.76 Ám	0.36 in	9.14 mm
Aries Electronics 32-6508-312	Brass	2 x 16	32	DIP	0.6 in	15.24 mm	2.54 mm	0.1 in	Through Hole	Wire Wrap	Gold	-55 °C	125 °C	0.1 in	2.54 mm	0.5 in	12.7 mm	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	UL94 V-0	3 A	Beryllium Copper	30 Áin	0.76 Ám
Aries Electronics 32-6508-202	Brass	2 x 16	32	DIP	0.6 in	15.24 mm	2.54 mm	0.1 in	Through Hole	Wire Wrap	Gold	-55 °C	105 ░C	0.1 in	2.54 mm			Tin	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	UL94 V-0	3 A	Beryllium Copper	30 Áin	0.76 Ám	0.36 in	9.14 mm
Aries Electronics 32-6508-211	Brass	2 x 16	32	DIP	0.6 in	15.24 mm	2.54 mm	0.1 in	Through Hole	Wire Wrap	Gold	-55 °C	125 °C	0.1 in	2.54 mm	0.5 in	12.7 mm	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	UL94 V-0	3 A	Beryllium Copper	30 Áin	0.76 Ám
Aries Electronics 32-6508-21	Brass	2 x 16	32	DIP	0.6 in	15.24 mm	2.54 mm	0.1 in	Through Hole	Wire Wrap	Gold	-55 °C	125 °C	0.1 in	2.54 mm	0.5 in	12.7 mm	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Open Frame	UL94 V-0	3 A	Beryllium Copper	30 Áin	0.76 Ám