MDT275 Series

Catalog

CONN M.2 FMALE 67POS 0.020 GOLD

Part	Contact Finish Thickness	Read Out	Features	Material - Insulation	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Color	Number of Positions	Mounting Type	Card Type	Contact Material	Gender	Pitch [x]	Pitch [x]	Number of Rows	Contact Finish	Contact Finish Thickness	Contact Finish Thickness
Amphenol ICC (FCI) MDT275E03001	Flash	Dual	Board Lock Keyed E	Liquid Crystal Polymer (LCP)	-40 °C	80 C	Solder	Black	67	Surface Mount Right Angle	M.2 (NGFF) Mini Card	Copper Alloy	Female	0.5 mm	0.02 in	2	Gold
Amphenol ICC (FCI) MDT275A01001		Dual	Board Lock Keyed	Liquid Crystal Polymer (LCP)	-40 °C	80 C	Solder	Black	67	Surface Mount Right Angle	M.2 (NGFF) Mini Card	Copper Alloy	Female	0.5 mm	0.02 in	2	Gold	0.76 Ám	30 Áin
Amphenol ICC (FCI) MDT275E02001		Dual	Board Lock Keyed E	Liquid Crystal Polymer (LCP)	-40 °C	80 C	Solder	Black	67	Surface Mount Right Angle	M.2 (NGFF) Mini Card	Copper Alloy	Female	0.5 mm	0.02 in	2	Gold	0.38 µm	15 µin
Amphenol ICC (FCI) MDT275A02001		Dual	Board Lock Keyed A	Liquid Crystal Polymer (LCP)	-40 °C	80 C	Solder	Black	67	Surface Mount Right Angle	M.2 (NGFF) Mini Card	Copper Alloy	Female	0.5 mm	0.02 in	2	Gold	0.38 µm	15 µin
Amphenol ICC (FCI) MDT275M03001	Flash	Dual	Board Lock Keyed M	Liquid Crystal Polymer (LCP)	-40 °C	80 C	Solder	Black	67	Surface Mount Right Angle	M.2 (NGFF) Mini Card	Copper Alloy	Female	0.5 mm	0.02 in	2	Gold