IC FLASH 4MBIT SPI 100MHZ 8WSON
| Part | Technology | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Clock Frequency | Supplier Device Package | Memory Format | Memory Organization | Memory Size | Memory Interface | Memory Type | Voltage - Supply [Min] | Voltage - Supply [Max] | Package / Case | Write Cycle Time - Word, Page | Package / Case [y] | Package / Case [x] | Package / Case | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | FLASH | Surface Mount | 85 °C | -40 °C | 100 MHz | 8-WSON (6x5) | FLASH | 512 K | 512 kb | SPI | Non-Volatile | 2.7 V | 3.6 V | 8-WDFN Exposed Pad | 3 ms | ||||
Winbond Electronics | FLASH | Surface Mount | 85 °C | -40 °C | 104 MHz | 8-SOIC | FLASH | 512 K | 512 kb | SPI | Non-Volatile | 2.3 V | 3.6 V | 8-SOIC | 800 µs | 5.3 mm | 0.209 " | ||
Winbond Electronics | FLASH | Surface Mount | 85 °C | -40 °C | 104 MHz | 8-USON (2x3) | FLASH | 512 K | 512 kb | SPI | Non-Volatile | 2.3 V | 3.6 V | 8-UFDFN Exposed Pad | 800 µs | ||||
Winbond Electronics | FLASH | Surface Mount | 85 °C | -40 °C | 104 MHz | 8-SOIC | FLASH | 512 K | 512 kb | SPI | Non-Volatile | 2.3 V | 3.6 V | 8-SOIC | 800 µs | 5.3 mm | 0.209 " | ||
Winbond Electronics | FLASH | Surface Mount | 85 °C | -40 °C | 104 MHz | 8-SOIC | FLASH | 512 K | 512 kb | SPI | Non-Volatile | 2.7 V | 3.6 V | 8-SOIC | 3 ms | 5.3 mm | 0.209 " | ||
Winbond Electronics | FLASH | Surface Mount | 85 °C | -40 °C | 75 MHz | 8-SOIC | FLASH | 512 K | 512 kb | SPI | Non-Volatile | 2.7 V | 3.6 V | 8-SOIC | 3 ms | 5.3 mm | 0.209 " | ||
Winbond Electronics | FLASH | Through Hole | 85 °C | -40 °C | 104 MHz | 8-PDIP | FLASH | 512 K | 512 kb | SPI | Non-Volatile | 2.7 V | 3.6 V | 8-DIP | 3 ms | 0.3 in | 7.62 mm | ||
Winbond Electronics | FLASH | Surface Mount | 85 °C | -40 °C | 104 MHz | 8-SOIC | FLASH | 512 K | 512 kb | SPI | Non-Volatile | 2.7 V | 3.6 V | 8-SOIC | 3 ms | 3.9 mm | 0.154 in | ||
Winbond Electronics | FLASH | Surface Mount | 85 °C | -40 °C | 100 MHz | 8-SOIC | FLASH | 512 K | 512 kb | SPI | Non-Volatile | 2.7 V | 3.6 V | 8-SOIC | 3 ms | 5.3 mm | 0.209 " | ||
Winbond Electronics | FLASH | Through Hole | 85 °C | -40 °C | 100 MHz | 8-PDIP | FLASH | 512 K | 512 kb | SPI | Non-Volatile | 2.7 V | 3.6 V | 8-DIP | 3 ms | 0.3 in | 7.62 mm |