CONN HEADER SMD 49POS 1MM
| Part | Number of Positions | Termination | Connector Type | Number of Positions Loaded | Mated Stacking Heights [z] | Insulation Height | Insulation Height | Operating Temperature [Min] | Operating Temperature [Max] | Shrouding | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Mounting Type | Contact Length - Mating | Contact Length - Mating | Insulation Material | Number of Rows | Contact Finish - Mating | Contact Material | Contact Finish - Post | Material Flammability Rating | Contact Shape | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Insulation Color | Fastening Type | Contact Type | Features | Mated Stacking Heights | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 49 | Solder | Header | All | 4.14 mm | 0.154 in | 3.9 mm | -55 °C | 125 °C | Shrouded - 4 Wall | 2.54 mm | 0.1 in | Surface Mount | 0.065 in | 1.65 mm | Liquid Crystal Polymer (LCP) | 2 | Gold | Phosphor Bronze | Tin | UL94 V-0 | Square | 2.8 A per Contact | 0.039 in | 1 mm | 10 çin | 0.25 çm | Black | Push-Pull | Male Pin | ||||
Samtec Inc. | 49 | Solder | Header | All | 4.14 mm | 0.154 in | 3.9 mm | -55 °C | 125 °C | Shrouded - 4 Wall | 2.54 mm | 0.1 in | Surface Mount | 0.065 in | 1.65 mm | Liquid Crystal Polymer (LCP) | 2 | Gold | Phosphor Bronze | Tin | UL94 V-0 | Square | 2.8 A per Contact | 0.039 in | 1 mm | 10 çin | 0.25 çm | Black | Push-Pull | Male Pin | End Shrouds Pick and Place | |||
Samtec Inc. | 49 | Solder | Header | All | 0.177 in | 4.5 mm | -55 °C | 125 °C | Unshrouded | 2.54 mm | 0.1 in | Surface Mount | 0.065 in | 1.65 mm | Liquid Crystal Polymer (LCP) | 2 | Gold | Phosphor Bronze | Tin | UL94 V-0 | Square | 2.8 A per Contact | 0.039 in | 1 mm | 10 çin | 0.25 çm | Black | Push-Pull | Male Pin | 7 mm | ||||
Samtec Inc. | 49 | Solder | Header | All | 0.188 " | 4.78 mm | -55 °C | 125 °C | Shrouded - 4 Wall | 2.54 mm | 0.1 in | Surface Mount | 0.065 in | 1.65 mm | Liquid Crystal Polymer (LCP) | 2 | Gold | Phosphor Bronze | Gold | UL94 V-0 | Square | 2.8 A per Contact | 0.039 in | 1 mm | 30 Áin | 0.76 Ám | Black | Push-Pull | Male Pin | 5 mm | 3 µin | 0.076 µm | ||
Samtec Inc. | 49 | Solder | Header | All | 0.188 " | 4.78 mm | -55 °C | 125 °C | Shrouded - 4 Wall | 2.54 mm | 0.1 in | Surface Mount | 0.065 in | 1.65 mm | Liquid Crystal Polymer (LCP) | 2 | Gold | Phosphor Bronze | Gold | UL94 V-0 | Square | 2.8 A per Contact | 0.039 in | 1 mm | 30 Áin | 0.76 Ám | Black | Push-Pull | Male Pin | 5 mm | 3 µin | 0.076 µm | ||
Samtec Inc. | 49 | Solder | Header | All | 0.177 in | 4.5 mm | -55 °C | 125 °C | Unshrouded | 2.54 mm | 0.1 in | Surface Mount | 0.065 in | 1.65 mm | Liquid Crystal Polymer (LCP) | 2 | Gold | Phosphor Bronze | Tin | UL94 V-0 | Square | 2.8 A per Contact | 0.039 in | 1 mm | 3 µin | 0.076 µm | Black | Push-Pull | Male Pin | Board Guide | 7 mm |