Beta
⌘K
CONN PCI EXP FMALE 98POS 0.039
| Part | Read Out | Mounting Type | Number of Rows | Number of Positions | Card Type | Contact Type | Contact Finish | Contact Material | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] | Operating Temperature [Max] | Operating Temperature [Min] | Termination | Contact Finish Thickness | Contact Finish Thickness | Material - Insulation | Color | Card Thickness | Card Thickness | Features | Pitch [x] | Pitch [x] | Gender |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | Dual | Through Hole | 2 | 98 | PCI Express™ | Cantilever | Gold | Copper Alloy | 38 | 11 | 85 °C | -55 °C | Press-Fit | 0.76 Ám | 30 Áin | Glass Filled Nylon Polyamide (PA) | Black | 0.062 in | 1.57 mm | Board Guide Locking Ramp | 0.039 in | 1 mm | Female |
Amphenol ICC (FCI) | Dual | Through Hole | 2 | 98 | PCI Express™ | Cantilever | Gold | Copper Alloy | 38 | 11 | 85 °C | -55 °C | Solder Staggered | 0.76 Ám | 30 Áin | Glass Filled Nylon Polyamide (PA) | Black | 0.062 in | 1.57 mm | Board Guide Locking Ramp | 0.039 in | 1 mm | Female |
Amphenol ICC (FCI) | Dual | Through Hole | 2 | 98 | PCI Express™ | Cantilever | Gold | Copper Alloy | 38 | 11 | 85 °C | -55 °C | Press-Fit | 0.76 Ám | 30 Áin | Glass Filled Nylon Polyamide (PA) | Black | 0.062 in | 1.57 mm | Board Guide Locking Ramp | 0.039 in | 1 mm | Female |