NOR FLASH SERIAL (SPI, DUAL SPI, QUAD SPI) 1.8V 64M-BIT 8M X 8 6NS 8-PIN WSON EP TUBE
| Part | Write Cycle Time - Word, Page | Package / Case | Voltage - Supply [Max] | Voltage - Supply [Min] | Memory Type | Memory Format | Operating Temperature [Max] | Operating Temperature [Min] | Memory Size | Technology | Supplier Device Package | Mounting Type | Clock Frequency | Memory Interface | Memory Organization | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Access Time | Package / Case [y] | Package / Case [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 3 ms | 8-WDFN Exposed Pad | 1.95 V | 1.7 V | Non-Volatile | FLASH | 85 °C | -40 °C | 64 Gbit | FLASH - NOR | 8-WSON (6x5) | Surface Mount | 133 MHz | SPI - Quad I/O | 8M x 8 | |||||
Winbond Electronics | 8-SOIC | 1.95 V | 1.65 V | Non-Volatile | FLASH | 105 °C | -40 °C | 64 Gbit | FLASH - NOR | 8-SOIC | Surface Mount | 104 MHz | QPI Quad I/O SPI | 8M x 8 | 5 ms | 60 µs | 6 ns | 5.3 mm | 0.209 " | |
Winbond Electronics | 3 ms | 8-SOIC | 3.6 V | 2.7 V | Non-Volatile | FLASH | 85 °C | -40 °C | 64 Gbit | FLASH - NOR | 8-VSOP | Surface Mount | 133 MHz | SPI - Quad I/O | 8M x 8 | 5.3 mm | 0.209 " | |||
Winbond Electronics | 8-SOIC | 3.6 V | 2.7 V | Non-Volatile | FLASH | 85 °C | -40 °C | 64 Gbit | FLASH - NOR | 8-SOIC | Surface Mount | 80 MHz | SPI - Quad I/O | 8M x 8 | 3 ms | 50 µs | 5.3 mm | 0.209 " | ||
Winbond Electronics | 3 ms | 8-XDFN Exposed Pad | 1.95 V | 1.7 V | Non-Volatile | FLASH | 85 °C | -40 °C | 64 Gbit | FLASH - NOR | 8-XSON (4x4) | Surface Mount | 133 MHz | SPI - Quad I/O | 8M x 8 | |||||
Winbond Electronics | 5 ms | 8-WDFN Exposed Pad | 1.95 V | 1.65 V | Non-Volatile | FLASH | 85 °C | -40 °C | 64 Gbit | FLASH - NOR | 8-WSON (6x5) | Surface Mount | 104 MHz | QPI Quad I/O SPI | 8M x 8 | |||||
Winbond Electronics | 8-SOIC | 3.6 V | 2.7 V | Non-Volatile | FLASH | 85 °C | -40 °C | 64 Gbit | FLASH - NOR | 8-SOIC | Surface Mount | 104 MHz | QPI Quad I/O SPI | 8M x 8 | 3 ms | 50 µs | 5.3 mm | 0.209 " | ||
Winbond Electronics | 3 ms | 8-SOIC | 3.6 V | 2.7 V | Non-Volatile | FLASH | 85 °C | -40 °C | 64 Gbit | FLASH - NOR | 8-SOIC | Surface Mount | 133 MHz | SPI - Quad I/O | 8M x 8 | 5.3 mm | 0.209 " | |||
Winbond Electronics | 8-WDFN Exposed Pad | 3.6 V | 2.7 V | Non-Volatile | FLASH | 85 °C | -40 °C | 64 Gbit | FLASH - NOR | 8-WSON (8x6) | Surface Mount | 80 MHz | SPI - Quad I/O | 8M x 8 | 3 ms | 50 µs | ||||
Winbond Electronics | 16-SOIC | 3.6 V | 2.7 V | Non-Volatile | FLASH | 105 °C | -40 °C | 64 Gbit | FLASH - NOR | 16-SOIC | Surface Mount | 80 MHz | SPI - Quad I/O | 8M x 8 | 3 ms | 50 µs | 7.5 mm | 0.295 in |