44-3571 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS TIN

Part	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Features	Pitch - Post	Pitch - Post	Contact Material - Mating	Number of Positions or Pins (Grid)	Mounting Type	Housing Material	Termination	Type	Type	Type	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Contact Finish - Mating
Aries Electronics 44-3571-10	Beryllium Copper	200 µin	5.08 µm	Tin	5.08 µm	200 µin	0.1 in	2.54 mm	Closed Frame	2.54 mm	0.1 in	Beryllium Copper	44 Positions or Pins	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	1 A	0.11 in	2.78 mm	UL94 V-0
Aries Electronics 44-3571-11	Beryllium Copper	10 çin	0.25 çm	Gold	0.25 çm	10 çin	0.1 in	2.54 mm	Closed Frame	2.54 mm	0.1 in	Beryllium Copper	44 Positions or Pins	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	1 A	0.11 in	2.78 mm	UL94 V-0	Gold
Aries Electronics 44-3571-16	Beryllium Nickel	50 µin	1.27 µm	Nickel Boron	1.27 µm	50 µin	0.1 in	2.54 mm	Closed Frame	2.54 mm	0.1 in	Beryllium Nickel	44 Positions or Pins	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	1 A	0.11 in	2.78 mm	UL94 V-0	Nickel Boron