CONN D-SUB HD PLUG 26P R/A SLDR
| Part | Termination | Number of Positions | Shell Size, Connector Layout | Shell Size, Connector Layout | Operating Temperature [Min] | Operating Temperature [Max] | Backset Spacing | Backset Spacing | Contact Finish Thickness | Contact Form | Voltage Rating | Contact Type | Dielectric Material | Number of Rows | Mounting Type | Connector Type | Features | Current Rating (Amps) | Contact Material | Material Flammability Rating | Connector Style | Flange Feature | Contact Finish | Contact Finish Thickness | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (Commercial Products) | Solder | 26 | 2 | (DA A) High Density | -55 °C | 150 °C | 8.89 mm | 0.35 in | Flash | Stamped | 300 VDC | Signal | Thermoplastic Glass Filled | 3 | Through Hole Right Angle | Male Pins Plug | Board Lock Grounding Indents | 3 A | Copper Alloy | UL94 V-0 | D-Sub High Density | Female Screwlock (M3) Mating Side | Gold | ||
Amphenol ICC (Commercial Products) | Solder | 26 | 2 | (DA A) High Density | -55 °C | 150 °C | 8.89 mm | 0.35 in | Stamped | 300 VDC | Signal | Thermoplastic Glass Filled | 3 | Through Hole Right Angle | Male Pins Plug | Board Lock Grounding Indents | 3 A | Copper Alloy | UL94 V-0 | D-Sub High Density | Board Side (M3) | Gold | 15 µin | 0.38 µm | |
Amphenol ICC (Commercial Products) | Solder | 26 | 2 | (DA A) High Density | -55 °C | 150 °C | 8.89 mm | 0.35 in | Stamped | 300 VDC | Signal | Thermoplastic Glass Filled | 3 | Through Hole Right Angle | Male Pins Plug | Board Lock Grounding Indents | 3 A | Copper Alloy | UL94 V-0 | D-Sub High Density | Female Screwlock (M3) Mating Side | Gold | 15 µin | 0.38 µm | |
Amphenol ICC (Commercial Products) | Solder | 26 | 2 | (DA A) High Density | -55 °C | 150 °C | 8.89 mm | 0.35 in | Stamped | 300 VDC | Signal | Thermoplastic Glass Filled | 3 | Through Hole Right Angle | Male Pins Plug | Board Lock Grounding Indents | 3 A | Copper Alloy | UL94 V-0 | D-Sub High Density | Female Screwlock (M3) Mating Side | Gold | 30 Áin | 0.76 Ám | |
Amphenol ICC (Commercial Products) | Solder | 26 | 2 | (DA A) High Density | -55 °C | 150 °C | 8.89 mm | 0.35 in | Stamped | 300 VDC | Signal | Thermoplastic Glass Filled | 3 | Through Hole Right Angle | Male Pins Plug | Board Lock Grounding Indents | 3 A | Copper Alloy | UL94 V-0 | D-Sub High Density | Board Side (M3) | Gold | 30 Áin | 0.76 Ám |