64-9508 Series

Catalog

CONN IC DIP SOCKET 64POS GOLD

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Features	Current Rating (Amps)	Operating Temperature [Max]	Operating Temperature [Min]	Type	Type	Type	Housing Material	Pitch - Post	Pitch - Post	Contact Finish - Post	Contact Finish - Mating	Contact Material - Post [custom]	Mounting Type	Termination Post Length	Termination Post Length	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 64-9508-30	200 µin	5.08 µm	64	30 Áin	0.76 Ám	Wire Wrap	Open Frame	3 A	105 ░C	-55 °C	22.86 mm	DIP	0.9 in	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	Tin	Gold	Brass	Through Hole	0.5 in	12.7 mm	Beryllium Copper	0.1 in	2.54 mm	UL94 V-0
Aries Electronics 64-9508-21	10 çin	0.25 çm	64	30 Áin	0.76 Ám	Wire Wrap	Open Frame	3 A	125 °C	-55 °C	22.86 mm	DIP	0.9 in	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	Gold	Gold	Brass	Through Hole			Beryllium Copper	0.1 in	2.54 mm	UL94 V-0	0.36 in	9.14 mm
Aries Electronics 64-9508-20	200 µin	5.08 µm	64	30 Áin	0.76 Ám	Wire Wrap	Open Frame	3 A	105 ░C	-55 °C	22.86 mm	DIP	0.9 in	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	Tin	Gold	Brass	Through Hole			Beryllium Copper	0.1 in	2.54 mm	UL94 V-0	0.36 in	9.14 mm
Aries Electronics 64-9508-31	10 çin	0.25 çm	64	30 Áin	0.76 Ám	Wire Wrap	Open Frame	3 A	125 °C	-55 °C	22.86 mm	DIP	0.9 in	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	Gold	Gold	Brass	Through Hole	0.5 in	12.7 mm	Beryllium Copper	0.1 in	2.54 mm	UL94 V-0