Beta
⌘K
CONN IC DIP SOCKET 40POS GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Housing Material | Material Flammability Rating | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Features | Mounting Type | Contact Finish - Mating | Termination Post Length | Termination Post Length | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Mating | Type | Type | Type | Current Rating (Amps) | Contact Finish - Post | Termination | Pitch - Mating | Pitch - Mating | Contact Material - Post [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 30 Áin | 0.76 Ám | Glass Filled Nylon 4/6 Polyamide (PA46) | UL94 V-0 | 2.54 mm | 0.1 in | 40 | 20 | 2 | Closed Frame Elevated | Through Hole | Gold | 3.56 mm | 0.14 in | 10 çin | 0.25 çm | 105 ░C | -55 °C | Beryllium Copper | DIP | 0.6 in | 15.24 mm | 3 A | Gold | Solder | 0.1 in | 2.54 mm | Brass |