44-3552 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS

Part	Type	Type	Type	Current Rating (Amps)	Contact Material - Post	Housing Material	Features	Termination	Material Flammability Rating	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length	Termination Post Length	Mounting Type	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Material - Mating	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 44-3552-16	7.62 mm	0.3 in	DIP ZIF (ZIP)	1 A	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	Solder	UL94 V-0	44 Positions or Pins	1.27 µm	50 µin	0.11 in	2.78 mm	Through Hole	Nickel Boron	0.1 in	2.54 mm	Nickel Boron	Beryllium Copper	2.54 mm	0.1 in	1.27 µm	50 µin
Aries Electronics 44-3552-10	7.62 mm	0.3 in	DIP ZIF (ZIP)	1 A	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	Solder	UL94 V-0	44 Positions or Pins	5.08 µm	200 µin	0.11 in	2.78 mm	Through Hole	Tin	0.1 in	2.54 mm		Beryllium Copper	2.54 mm	0.1 in	5.08 µm	200 µin
Aries Electronics 44-3552-18	7.62 mm	0.3 in	DIP ZIF (ZIP)	1 A	Beryllium Nickel	Polyetheretherketone (PEEK) Glass Filled	Closed Frame	Solder	UL94 V-0	44 Positions or Pins	1.27 µm	50 µin	0.11 in	2.78 mm	Through Hole	Nickel Boron	0.1 in	2.54 mm	Nickel Boron	Beryllium Nickel	2.54 mm	0.1 in	1.27 µm	50 µin	-55 °C	250 °C
Aries Electronics 44-3552-11	7.62 mm	0.3 in	DIP ZIF (ZIP)	1 A	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	Solder	UL94 V-0	44 Positions or Pins			0.11 in	2.78 mm	Through Hole	Gold	0.1 in	2.54 mm	Gold	Beryllium Copper	2.54 mm	0.1 in