Beta
⌘K
CONN PCI EXP FMALE 280POS 0.039
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Mounting Type | Number of Rows | Contact Finish Thickness | Termination | Read Out | Gender | Features | Card Thickness | Card Thickness | Contact Finish | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] | Color | Contact Material | Number of Positions | Card Type | Material - Insulation | Contact Type | Pitch [x] | Pitch [x] | Contact Finish Thickness | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | 85 °C | -55 °C | Through Hole | 2 | Flash | Solder Staggered | Dual | Female | Board Guide Locking Ramp | 0.062 in | 1.57 mm | Gold | 91 | 38 | 11 | Black | Copper Alloy | 280 | PCI Express™ | Glass Filled Nylon Polyamide (PA) | Cantilever | 0.039 in | 1 mm | ||
Amphenol ICC (FCI) | 85 °C | -55 °C | Through Hole | 2 | Solder Staggered | Dual | Female | Board Guide Locking Ramp | 0.062 in | 1.57 mm | Gold | 91 | 38 | 11 | Black | Copper Alloy | 280 | PCI Express™ | Glass Filled Nylon Polyamide (PA) | Cantilever | 0.039 in | 1 mm | 15 µin | 0.38 µm | |
Amphenol ICC (FCI) | 85 °C | -55 °C | Through Hole | 2 | Solder Staggered | Dual | Female | Board Guide Locking Ramp | 0.062 in | 1.57 mm | Gold | 91 | 38 | 11 | Black | Copper Alloy | 280 | PCI Express™ | Glass Filled Nylon Polyamide (PA) | Cantilever | 0.039 in | 1 mm | 15 µin | 0.38 µm | |
Amphenol ICC (FCI) | 85 °C | -55 °C | Through Hole | 2 | Solder Staggered | Dual | Female | 0.062 in | 1.57 mm | Gold | 91 | 38 | 11 | Black | Copper Alloy | 280 | PCI Express™ | Glass Filled Nylon Polyamide (PA) | Cantilever | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám |