44-6553 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS

Part	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length	Termination Post Length	Features	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Contact Material - Mating	Contact Finish - Post	Housing Material	Mounting Type	Pitch - Post	Pitch - Post	Contact Material - Post	Type	Type	Type	Number of Positions or Pins (Grid)	Material Flammability Rating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 44-6553-18	1 A	0.1 in	2.54 mm	1.27 µm	50 µin	0.11 in	2.78 mm	Closed Frame	Solder	1.27 µm	50 µin	Nickel Boron	Beryllium Nickel	Nickel Boron	Polyetheretherketone (PEEK) Glass Filled	Through Hole	2.54 mm	0.1 in	Beryllium Nickel	15.24 mm	DIP ZIF (ZIP)	0.6 "	44 Positions or Pins	UL94 V-0	-55 °C	250 °C
Aries Electronics 44-6553-16	1 A	0.1 in	2.54 mm	1.27 µm	50 µin	0.11 in	2.78 mm	Closed Frame	Solder	1.27 µm	50 µin	Nickel Boron	Beryllium Copper	Nickel Boron	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	2.54 mm	0.1 in	Beryllium Copper	15.24 mm	DIP ZIF (ZIP)	0.6 "	44 Positions or Pins	UL94 V-0
Aries Electronics 44-6553-10	1 A	0.1 in	2.54 mm	5.08 µm	200 µin	0.11 in	2.78 mm	Closed Frame	Solder	5.08 µm	200 µin		Beryllium Copper	Tin	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	2.54 mm	0.1 in	Beryllium Copper	15.24 mm	DIP ZIF (ZIP)	0.6 "	44 Positions or Pins	UL94 V-0